MODULE 1: BASIC CONCEPTS OF LED LIGHTING SOURCES FOR GENERAL LIGHTING

1. Lecture 1: Basic concepts of Light Emitting Diodes (LEDs) and LED lights
   1. What are LEDs and how do they work?
   2. How are LEDs used in general lighting?
   3. Advantage and disadvantage of LEDs used in general lighting.
   4. Structure and features of LED lamps and luminaires.
   5. Heat and Lifetime of LED Lighting Products.
   6. Color of LED lights.
   7. How is LED lighting different than other light sources?
   8. How to choose LED lights for indoor and outdoor lighting?

2. Lecture 2: Core technologies for LED lighting products manufacturing
   1. Overview of core technologies for blue chip LED manufacturing
   2. InGaN/GaN system
   3. Epitaxy growth: buffer layer
   4. Metal-organic chemical vapor deposition (MOCVD) 
   5. Start-of-the-art of blue LED process
   6. Chip frontend process (mesa, transparent conductive layer (TCL), pad and passivation)
   7. Chip backend process (grinding, dicing, binning and sorting)
   8. Exercises

3. Lecture 3: LED chip packaging
   1. Overview of chip LED packaging
   2. Conventional LED packaging: (electrical connection, mechanical protection, integrity, heat dissipation of chip LED)
   3. High power LED packaging: dicing, die binding
   4. Interconnect technology (wire bonding, flip chip, through silicon via (TSV)
   5. Thermal management (sub-mount and substrate, thermal interface material, heat sink)
   6. Exercises

4. Lecture 4: Measurement & testing of LED Lights
   1. Main parameters of LED lights to be measured and tested
   2. Measurements and testing of LED Lights
   3. Failures of LED and LED lights
   4. Exercises